Tin Bismuth Low Temperature Solder Paste

MPN: Qualitek Delta 670
Tin Bismuth solder paste alloy for heat sensitive components and for low temperature soldering.
Note: Currently not available for delivery to Europe Zone 3, Europe Zone 4, Europe Zone 5, Europe Zone 6, Guernsey, Jersey, Australia, Brazil, Canada, Hong Kong, Malaysia, Mexico, New Zealand & USA and India.
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Product Description
The Qualitek 670 tin bismuth solder paste has been developed for low temperature soldering. With a melting point of 138°C and a peak reflow temperature of approximately 173°C the 670 tin bismuth paste is suitable for soldering of temperature sensitive surface mount components. The 670 is a no clean solder paste.
A eutectic Sn42 Bi58 solder alloy with a low melting point
Non-corrosive clear residues
Available as a type 3 (25-45um) particle size
Available in syringes and jars
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Specification
No Clean 670 flux
Eutectic Sn42 Bi58 alloy
Melting point 138C
Peak reflow temperature of 160 - 175C
Bellcore compliant
Tack Time: 4 - 8 hours
Processable by Reflow IR or forced convection and Vapour phase.