Tin Bismuth Low Temperature Solder Paste

Product Description

The Qualitek 670 tin bismuth solder paste has been developed for low temperature soldering. With a melting point of 138°C and a peak reflow temperature of approximately 173°C the 670 tin bismuth paste is suitable for soldering of temperature sensitive surface mount components. The 670 is a no clean solder paste. 

A eutectic Sn42 Bi58 solder alloy with a low melting point

Non-corrosive clear residues

Available as a type 3 (25-45um) particle size

Available in syringes and jars

View other products in Solder pastes »

Customer Reviews

By Future Sound Systems on 24th September 2018

"This solder paste works brilliantly in our reflow oven and has a great consistency when pasting boards up. It easily beats alternatives we've tried from the likes of ChipQuik, etc."

By Angi Findlater on 20th February 2018

"I needed a very low melt solder for my Pewter projects this was just the ticket, it worked very well. The only thing that would help future purchases would be a link under the product to which size nozzle should be bought with it as i had to guess, the ones I bought were so tiny it's very hard to visualise if you have never used this product before."

By Philip Tilson on 15th August 2015

"Seems to be very satisfactory. Good viscosity - spreads easily across laser stencil but doesn't slump. Melts evenly and appears to give good, consistent joints. Will use again."

Reflow Profile

Specification

No Clean 670 flux
Eutectic Sn42 Bi58 alloy
Melting point 138C
Peak reflow temperature of 160 - 175C
Bellcore compliant
Tack Time: 4 - 8 hours
Processable by Reflow IR or forced convection and Vapour phase.

Safety Data Sheet CLP