Qualitek 863 Lead Free Solder Paste
This Qualitek SAC305 alloy solder paste has an excellent no clean 863 flux giving great soldering results.
- Available in 250g and 500g jars
- Order from a type 3 solder particle size or finer type 4
- With a stencil life greater than 8 hours
- No-clean flux residues which can be cleaned if required
No Clean flux
Flux classification: ROL0
Alloy: SAC305 Tin Silver Copper (Sn96.5/Ag3.0/Cu0.5)
Metal loading: 88 - 89%
Melting range: 217 - 219°C
Peak reflow temperature range: 230 - 249°C
Stencil life: > 8 hours
Processable by Reflow IR or forced convection and Vapour phase
No clean solder paste. If cleaning is required use a buffered saponifier such as the Everkleen 1005 in hot water to remove residues.
Standard DeliveryUsual shipping within 2-5 days
The Qualitek 863 no clean lead free solder paste is an excellent product for SMT component placement. With a flux and activators giving excellent wetting, long tack time on a printed board, long stencil life and resistance to hot slump through reflow, the 863 No Clean solder paste is the answer.
Excellent wetting on all PCB surfaces
Excellent resistance to hot slump
Available as a type 3 and type 4 SAC305 solder paste
89% metal loading
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