Flux Gel for Tin Bismuth solder wire
A flux gel for use with the Qualitek Tin Bismuth solid core solder wire. Promotes wetting and excellent PCB soldering.
Standard DeliveryUsual shipping within 2-5 days
A high grade synthetic resin flux, the PF670 flux gel is designed for aiding the wetting of solid core Tin Bismuth solder wire, but can be used to promote wetting on many substrates. For the repair and rework of electronic assemblies this flux gel can be brushed on, dipped or dispensed by hand or dispensing machine.
Available in either a 10cc (8g) or 30cc (24g) syringe
Fitted with piston and plunger for hand assembly*
Non-corrosive and non-conductive no clean residues
* Can be supplied without plunger on request
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Colour and Appearance: Amber
pH: 5.1 - 5.7
Surface Insulation Resistance (SIR): >1.0 x 10(10)
Storage Temperature: 22C - 26C (Room Temperature)
Shelf Life: 1 year
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