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SMT Epoxy Adhesive 2217L

From £16.62 £13.85
In Stock
Only %1 left
MPN: Threebond 2217L

A low temperature curing single pack SMT component bonding adhesive which cures at a very low temperature as low as 80°C . The Threebond 2217L is available in syringes and jars.

  • The adhesive can be applied by syringe or by stencil printing
  • Syringes are Leur lock Semco ones
  • Hardens in less than 60 seconds at 150°C
  • Single pack epoxy resin gives exceptional strong bond strength
  • Meets the requirements of IPC SM817

Typical Curing time:
80°C    200 - 230 seconds
100°C  70 - 100 seconds
120°C  50 - 80 seconds
150°C  35 - 65 seconds

Threebond SMT Adhesive 2217L


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The Threebond TB2217L adhesive offers low temperature curing at 80°C making it ideal for temperature-sensitive components. At 80°C the curing time is 220 seconds; increase the heat and the cure is quicker i.e a 60-second cure at 150°C. Whether dispensed by syringe or by stencil printing, the 2217L produces an excellent deposited dot, excellent tack strength, and after curing exceptional bond strength.

Meets the requirements of IPC SM817, TM-650 Method R-1206 on bare FR4 board supported 60 seconds above solder bath at 260ºC and dipped for 10 seconds

SDS for the 2217L SMT adhesive



More Information
BrandThreebond Adhesives
Collect in StoreYes
MPNThreebond 2217L
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