Tin Bismuth Low Temperature Solder Paste
Tin Bismuth solder paste alloy for heat sensitive components and for low temperature soldering.
The Qualitek 670 tin bismuth solder paste has been developed for low temperature soldering. With a melting point of 138°C and a peak reflow temperature of approximately 173°C the 670 tin bismuth paste is suitable for soldering of temperature sensitive surface mount components. The 670 is a no clean solder paste.
A eutectic Sn42 Bi58 solder alloy with a low melting point
Non-corrosive clear residues
Available as a type 3 (25-45um) particle size
Available in syringes and jars