Tin Bismuth solder paste alloy for heat sensitive components and for low temperature soldering.
The Qualitek 670 tin bismuth solder paste has been developed for low temperature soldering. With a melting point of 138°C and a peak reflow temperature of approximately 173°C the 670 tin bismuth paste is suitable for soldering of temperature sensitive surface mount components. The 670 is a no clean solder paste.
A eutectic Sn42 Bi58 solder alloy with a low melting point
Non-corrosive clear residues
Available as a type 3 (25-45um) particle size
Available in syringes and jars