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Tin Bismuth low melting solder wire 0.8mm

£82.20 £68.50
Available to Order
MPN: WSW-Sn42-32

A solid core solder wire manufactured from a Tin Bismuth low melting point alloy and in a thin 0.8mm gauge. Supplied as a 500g per box.

  • USE: Printed Circuit Board assembly (temperature-sensitive component soldering)
  • ALLOY: Tin 42% Bismuth 58%
  • MELTING TEMPERATURE: 138°C eutectic
  • FLUX: Solid Core
  • GAUGE: 0.8mm (21SWG)
  • REEL SIZE: 500g

Standard Delivery

Usual shipping within 2-5 days

Tin Bismuth solder wire, with a melting point of 138°C, is ideal for soldering of temperature-sensitive components. Supplied as a solid core (no inner flux core) lead-free solder wire, this solder gives good wetting and solder flow. Tin Bismuth solder can be used for additional work on PCB's soldered with a SAC alloy. Packaged as a 500g box this solder wire we recommend using with the PF670 flux gel to promote increased rapid wetting.

Low-temperature eutectic Tin Bismuth alloy

Prevents thermal damage to heat-sensitive devices

Not recommended for handheld devices due to Tin Bismuth brittle element (Products that can be subject to drop-shock)


More Information
Brand Qualitek
Customise No
Collect in Store No
Solder wire gauge 0.81mm
MPN WSW-Sn42-32
Solder Alloy Sn42Bi58
Melting Temperature 138°C
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