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Contact UsSMT Epoxy Adhesive
SMT adhesive syringe with plunger
MPN: Threebond 2217H
A low temperature curing single pack SMT component bonding adhesive available in syringes and jars.
2217H technical data sheetNote: Currently not available for delivery to Europe Zone 3, Europe Zone 4, Europe Zone 5 and Australia, Brazil, Canada, Hong, Kong, India, Malaysia, New Zealand & USA.
Delivery Options
Product Description
The Threebond TB2217H adhesive offers low temperature curing at 80°C making it ideal for temperature sensitive components. At 80°C the curing time is 220 seconds; increase the heat and the cure is quicker i.e a 60 second cure at 150°C. Whether dispensed by syringe or by stencil printing, the 2217H produces an excellent deposited dot, excellent tack strength and after curing exceptional bond strength.
Single pack epoxy resin giving exceptional strong bond strength
Hardens in less than 60 seconds at 150°C
Cures as low as 80°C
Ideal for syringe dispensing or stencil printing
Specification
Chemical type: Epoxy
Apearance: Pink paste
Curing time:
80°C 200 - 230 seconds
100°C 70 - 100 seconds
120°C 50 - 80 seconds
150°C 35 - 65 seconds
Packaging:
Semco syringe with Leur lock
Available with a piston and plunger for hand dispensing
Without for automatic dispensing machines
100g Jar for stencil printing
Safety Data Sheet CLP
