SMT Epoxy Adhesive
A low temperature curing single pack SMT component bonding adhesive available in syringes and jars.
The Threebond TB2217H adhesive offers low temperature curing at 80°C making it ideal for temperature sensitive components. At 80°C the curing time is 220 seconds; increase the heat and the cure is quicker i.e a 60 second cure at 150°C. Whether dispensed by syringe or by stencil printing, the 2217H produces an excellent deposited dot, excellent tack strength and after curing exceptional bond strength.
Single pack epoxy resin giving exceptional strong bond strength
Hardens in less than 60 seconds at 150°C
Cures as low as 80°C
Ideal for syringe dispensing or stencil printing
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Chemical type: Epoxy