Qualitek 798LF Lead Free Water Soluble Solder Paste

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MPN: DSP 798LF

A lead free paste that produces excellent bright solder joints after cleaning.

Note: Currently not available for delivery to Europe 1, Europe 2, Europe 3 and Australia, Brazil, Canada, Hong, Kong, India, Malaysia, New Zealand & USA.

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Description
Reflow Profile
Specification
Safety Data Sheet CLP
Features

Product Description

The Qualitek DSP 798LF Lead free solder paste is a water soluble product that once cleaned gives an excellent finish with bright shiny solder joints. With a long tack time and stencil life of 4 - 6 hours the 798LF solder paste exhibits excellent wettability and print definition.

89 - 90% metal loading

Low foaming at post cleaning

Available as a type 3 and type 4 lead free solder paste

Easily removed flux residues by warm DI Water

View other products in Solder pastes »

Reflow Profile

Specification

Flux classification: ORH1
Alloy: Tin Silver Copper SAC305 (Sn96.5/Ag3/Cu0.5)
Metal loading: 89 - 90%
Melting range: 217 - 219°C
Peak reflow temperature range: 230 - 249°C
Stencil life: 4 - 6 hours
Processable by Reflow IR or forced convection and Vapour phase.

Water soluble solder paste - must be cleaned. Use warm DI Water