New Type 5 solder paste for small SMT components
A New Lead Free Solder Paste for small SMT components.
With ever decreasing SMT component sizes come the challenges of developing a solder paste that can produce excellent results.
The smaller the surface mount component the more critical the volume of solder paste deposited by the stencil.
The same factors of stencil design and squeegee type play a very important part with all solder paste printing but small solder paste deposits require developments of new fluxes.
Almit Japan have developed the SUC-UI flux to give the following results:
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Better volume for 0201 and 01005 components
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Reduce of eliminate Nitrogen reflow
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Excellent printing performance hour after hour
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Maintain wetting using high & long Pre heat
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Wide reflow profile window
The type 5 lead free solder paste is available in the standard SAC305 solder alloy and available in 500g jars.
